BT8370KPF

Product Summary

The BT8370KPF is a Fully Integrated T1/E1 Framer and Line Interface. BT8370KPF is packaged in an 80-pin Metric Quad Flat Pack(MQFP). A pinout diagram of this device is illustrated in Figure 1-1. Figure 1-2 details a BT8370KPF logic diagram. Pin labels, names, I/O functions, and descriptions are provided in Table 1-1. The input pins listed below contain an internal pullup resistor (>50 kΩ) and can remain unconnected if the active-high input state is desired. All other unused input pins should be either pulled up or grounded.

Parametrics

BT8370KPF absolute maximum ratings: (1)VDD Power Supply (measured to GND): –0.5 to 7 V; (2)ΔVDD Voltage Differential (between any 2 VDD pins): 0.5 V; (3)Vi Constant Voltage on any Signal Pin: –1.0 to VDD + 0.5 V; (4)ESD Transient Voltage on any Signal Pin, HBM rating: ±2kV; CDM rating: ±700V; MMM rating: ±200V; (5)Ii Constant Current on any Signal Pin: –10 to +10 mA; (6)LATCHUP Transient Current on any Signal Pin, Digital Pins: –350 to 400mA; Analog Pins (TIP,RING): –350 to +400mA; (7)Ts Storage Temperature: –65 to 150 ℃; (8)Tj Junction Temperature: (θjA x VDD x IDD) + Tamb: –40 to 125 ℃; (9)Tvsol Vapor Phase Soldering Temperature (1 minute): 220 ℃; (10)θjA Thermal Resistance (80MQFP), Still Air: 43 ℃/W.

Features

BT8370KPF features: (1)Single-chip T1/E1 framer with short/long-haul physical line interface; (2)Frames to popular T1/E1 standards: T1: SF, ESF, SLC96, T1DM; E1: PCM-30, G.704, G.706, G.732 ISDN primary rate; (3)On-chip physical line interface compatible with: DSX-1/E1 short-haul signals; DS-1 (T1.403) and ETSI long-haul signals; (4)Two-frame transmit and receive PCM slip buffers; (5)Clock rate adapter synthesizes jitter attenuated system clocks from an internal or external reference; (6)Parallel 8-bit microprocessor port supports Intel or Motorola buses; (7)Automated Facility Data Link (FDL) management; (8)BERT generation and counting; (9)Two full-duplex HDLC controllers for data link and LAPD/SS7 signaling; (10)B8ZS/HDB3/Bit 7 zero suppression; (11)80-pin MQFP surface-mount package; (12)Operates from a single +5 Vdc ±5% power supply; (13)Low-power CMOS technology.

Diagrams